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ISO9001 PTH BGA PCB Board Assembly / High TG PCB 2 Layer 4 Layer
Quick Detail:
- OEM/ODM/EMS services for PCBA
- PCBA, PCB assembly: SMT, PTH and BGA
- PCBA and enclosure design
- Quick prototyping
- Plastic injection molding
- metal sheet stamping
- Final assembly
- Test: AOI, in-circuit test (ICT), functional test (FCT)
Detailed Specification of PCB Manufacturing
| 1 | layer | 1-30 layer |
| 2 | Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
| 3 | Board thickness | 0.2mm-6mm |
| 4 | Max.finished board size | 800*508mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | min.line width | 0.075mm(3mil) |
| 7 | min.line spacing | 0.075mm(3mil) |
| 8 | Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
| 9 | Copper thickness | 0.5-4.0oz |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing,Plastic bag |
| 12 | Outer packing | standard carton packing |
| 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| 14 | Certificate | UL,ISO9001,ISO14001,ROHS,TS16949 |
| 15 | Profiling punching | Routing,V-CUT,Beveling |
Detailed Specification of Pcb Assembly
| 1 | Type of Assembly | SMT and Thru-hole |
| 2 | Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
| 3 | Components | Passives Down to 0201 Size |
| BGA and VFBGA |
