Model 7374e (Beam Lead Die Bonders)

This machine adapted forultrasonic bonding, with heat, of the tab leads of beam lead diodes.The right head is used for pick up of the tabbed die with provision forrotation at placement. The left head used for bonding the tabs isequipped with K~Sine Model 46-D Ultrasonic Transducer and with radiantheat to the bond tool. Built-in ultrasonic power supply is K~Sine PartNo 6795, four Watts, dual channel. Settings of power and time programvalues are executed via an eight bit interface. Force is adjustable byforce spring through a range of 10 to 175 grams. This machine is veryeasy to use.SPECIFICATIONS:ConTROL LOGIC: Motorola 68000 MicroprocessorMEMORY: Battery back-up RAM DATA ENTRY: Selector switch Z TOOL RANGE: 0.5625 inch Z ENCODER RESOLUTION: 0.001 inchWORK PLATFORM: Elevation adjustable through 0.625 inchBOND FORCE RANGE: Adjustable, 10 to 175 grams TRANSDUCER: ½ wave, 63 KHz (nominal) ULTRASONICS: Built-in, 8 bit, 4 watts (Ultrasonic Positioning Utility)ESD PROTECTION:
Model 7374e (Beam Lead Die Bonders)