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High Frequency Microprocessors Thermal Interface Pad Low Resistance -25 - 125
The TIC™800P Series is low melting point thermal interface material. At 50, The TIC™800P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™800P Series shows no thermal performance degradation after 1,000 hours@130,or after 500 cycles, from -25 to 125.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features:
> 0.024-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
| Typical Properties of TIC™800P Series | |||||
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