Click image to view full size image
MLCC Dipping Chip Silver Plating Carrier Plate 1.3mm 20mil Hole Diameter
Thin Carrier Plate is Dipping Tool which can be used successfully to handle a veriety of Chip
componets such as MLCC ,MLCI,MLV Etc. they mainly used in the Dipping Machine and Yohotek Dipping Machine
Feature
1: Work temperature:130 or 160
2: Thickness:1.30mm(±0.02)
Advantages
Holding chip(Dipping chip)
High Load efficiency
Low distortion
Save time,Reduce labor and Tooling cost of Dipping
0603(0201) chip can be dipped Two side Easily
Defect-Free Dipping surface
Easy to Operate Automatically
Termination Bandwidth is easily controlled
MOQ:1000pcs
Customized design is available. OEM&ODM are welcome.
Specification
Item No : YTCP0402-020-13776-130
Hole Diameter(mil): 20.00
Hole Qty(mm) : 3776
Thickness(mm) : 130.00
| Item No | Hole Diameter(mil) | Hole Qty(mm) | Thickness(mm) |
| YTCP0402-020-13776-130 | 20.00 | 3776 | 1.30.00 |
Remark:
Customized design is available. OEM&ODM are welcome.
Applications:
1: For Holding chip(Dipping chip)
2: Auto-loading machine/Vibration machine, Air press,Dipping machine,oven,
Trade terms & conditions:
1. Payment term: 100% for sample; For bulk order: 30% deposit and 70% balance before shipment. 2. Payment way available: T/T, Paypal, Western Union. L/C
3. Lead time: 3-5 working days for samples, 10-15 working days for quantity order.
4. Shipping port: Shenzhen.
5. Delivery way: Via Sea, Air and Air express (DHL, FEDEX, EMS, UPS, TNT) or other ways.
6. MOQ: 5 piece.
7. Discounts: based on the quantity, normally above 500pcs, Special discount will be available.
MLCC Dipping Chip Silver Plating Carrier Plate 1.3mm 20mil Hole Diameter
