Qualcomm MDM9230 Chipset 4G Embedded Wireless Modules MC7455 USB 3.0
LTE-FDD,LTE-TDD HSPA+,TD-SCDMA
(B1-B5,,B7,B8,B12,B13,B17,B20,B25,B26,B29,B30,B41)
Main Specifications
Cellular
• FDD/TDD LTE (Cat 6)
1-5,7,8,12,13,17,20,25,26,29,30,41
• Carrier Aggregation
4+17, 2+17, 2+29, 4+5, 17+30, 2+13, 4+13, 4+4,
41+41, 3+20, 7+20, 3+3, 7+7
• DC-HSPA+ (42/5.76 Mbps)
1,2,3,4,5,8
Key Features
• Qualcomm MDM9230 chipset
• Single SKU for North America and Europe
• GNSS
• Dedicated GPS connector with GPS bias or
shared on diversity (TBD)
• GPS, Glonass, Galileo ,BeiDou
• SUPL 1.0, 2.0, XTRA2.0
• Optional support for VoLTE and CSFB voice through
future FW update
• Low power consumption
• Envelope tracking
• Software
• Gobi API, Image switching, MBIM interface
• Basic and Extended AT Commands
• Skylight for Windows 7, 8/8.1
• Linux and Android
Information
| Physical Characteristics | |
| 1 | • Mini card 51 X 30 X 2.75 [mm] |
| 2 | • USB 3.0 |
| 3 | • GPIOs for antenna tuning and SAR control |
| 4 | • PCM/I2S interface for voice (Future FW update) |
| Temperature ranges: | |
| 1 | Qualcomm MDM9230 Chipset 4G Embedded Wireless Modules MC7455 USB 3.0
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