Tyvek Round Wafer Isolated Packing Paper for Semiconductor P

DuPont Tyvek is made of high-density polyethylene filament through a special process, all for the clean aspects of raw materials have been to the static and anti-static coating treatment, which itself only need to be purified then can be applied to Clean grade higher environment, and the material itself in the purification will not cause secondary pollution. DuPont Tyvek is the only wafer packaging material that does not increase reading errors. Tyvek Tyvek’s (D-type) unique features make it becomes a good packing material in anti-static, integrated circuits, the electronics industry, silicon manufacturing, solar cells and other productS. The features includes:Unique surface smoothness, no friction, anti-static, waterproof, PH neutral, chemically inert, no lint, durable.

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Tyvek Round Wafer Isolated Packing Paper for Semiconductor P